2024-2025techQ1 · 2024

Multi-laser LPBF, larger build envelopes, binder jet scale-up, WAAM/DED, LFAM, CBAM, and high-resolution resin systems continue capability gains.

Multi-laser LPBF (up to 12 lasers) and larger build volumes are shifting the economics of metal AM production. Binder jetting scale-up at HP, Desktop Metal, and ExOne is testing whether sintering economics can match LPBF quality at volume.

presenthigh confidence · 82/100

01Audience fit

engineerleader

02Sources

01Metal AM — AMPOWER releases 2025 Additive Manufacturing market report2025-03-18
Summary of the AMPOWER Report 2025 market and technology review across metal and polymer AM systems. Supports the breadth-of-hardware trend at overview level; it does not individually verify each named process family.
02AMPOWER — AMPOWER Report on Additive Manufacturing (annual report page)2025-03
Publisher's page for the annual AMPOWER Report covering AM technology maturity and the supplier landscape.

Cite this page

APA

AM Roadmap. (2024). Multi-laser LPBF, larger build envelopes, binder jet scale-up, WAAM/DED, LFAM, CBAM, and high-resolution resin systems continue capability gains.. AM Roadmap (v0.5.2-evidence-gaps-closed). Retrieved 2026-08-24, from https://amroadmap.com/timeline/present-2024-2025-hardware-3

BibTeX

@misc{amroadmap_multi_laser_lpbf_larger_build_envelopes__2024,
  title  = {Multi-laser LPBF, larger build envelopes, binder jet scale-up, WAAM/DED, LFAM, CBAM, and high-resolution resin systems continue capability gains.},
  author = {{AM Roadmap}},
  year   = {2024},
  url    = {https://amroadmap.com/timeline/present-2024-2025-hardware-3},
  note   = {AM Roadmap dataset v0.5.2-evidence-gaps-closed, accessed 2026-08-24}
}

Canonical URL: https://amroadmap.com/timeline/present-2024-2025-hardware-3